PCB / FPCB Manufacturing
Consistent Quality from Prototype to Production
Advanced manufacturing equipment for high-quality rigid and flexible circuit board production, supporting rapid prototyping and mass production.
Request a QuotePCB Manufacturing
Complete PCB manufacturing from single-layer to 32-layer boards with advanced equipment and strict quality control.
- ✓Prototype and small batch production
- ✓24-48 hour rush prototyping (varies by layer count)
- ✓Mass production capability
- ✓100% electrical testing for mass production
PCB Specifications
FPCB Specifications
FPCB Manufacturing
Professional flexible circuit board manufacturing for applications requiring bending or folding, such as mobile phones, wearables, and medical devices.
- ✓Single to multi-layer flex boards
- ✓Rigid-flex combination boards
- ✓High flex reliability
- ✓Lightweight design
Industries Served
Consumer Electronics
Industrial Control
Communications
Medical Devices
Automotive
Security & Surveillance
IoT
Power Management
Complete PCB Manufacturing Process
From CAM engineering review to final E-Test, Shinly International follows IPC-A-600 Class 2/3 standards. The same process applies to multilayer and rigid-flex boards, ensuring consistent quality from prototype to volume production.
CAM Engineering Review
Gerber, drill file, and stackup review; DRC and DFM checks with design optimization feedback to prevent manufacturing bottlenecks.
Inner Layer Imaging
Dry film lamination, exposure, develop, etch; 100% inner-layer AOI inspection of trace width and spacing against design rules.
Lamination
Vacuum lamination with layer-to-layer registration controlled within ±50 μm; prepreg (PP) traceability records maintained.
Drilling
CNC mechanical drilling (min. 0.2 mm) and laser blind via (min. 0.1 mm); burr and roughness controlled to IPC standards.
Electroless Cu / Plating
Through-hole metallization and copper plating to design thickness; via copper micro-section verification ensures ≥ 25 μm for high current and signal stability.
Outer Layer Imaging
Outer layer exposure, etch, strip; AOI 100% coverage; multilayer boards additionally pass BBT (bare board test) for electrical continuity.
Solder Mask & Silkscreen
Solder mask coating (white / green / black), UV exposure, post-bake; silkscreen printing per customer logo and specification.
Surface Finish
Choose from Lead-free HASL, ENIG, OSP, ENEPIG, Immersion Tin/Silver — selected per application environment and soldering requirements.
Profiling & Final Test
V-Cut / routing / punch profiling; visual inspection and impedance test if required; 100% flying probe E-Test confirms electrical performance; OQC sampling before shipment.
Surface Finish Comparison
Different applications require different surface finishes. Shinly International offers all major options to help you choose the right one for your product.
| Finish | Characteristics | Best for | Cost |
|---|---|---|---|
| Lead-free HASL | Tin-coated, excellent solderability | General consumer electronics, through-hole | $ |
| ENIG | Flat surface, oxidation-resistant, RoHS | Fine-pitch BGA, QFN, keypads, bonding areas | $$$ |
| OSP | Organic protection, eco-friendly, low cost | High-volume short-cycle consumer goods | $ |
| ENEPIG | Ni/Pd/Au, supports soldering + wire bonding | 5G communication, semiconductor packaging, high-reliability | $$$$ |
| Immersion Tin / Silver | Flat, good solderability | Fine-pitch, short-term storage | $$ |
Frequently Asked Questions
Common questions about PCB / FPCB manufacturing
Q1. What is the fastest PCB prototype turnaround time?＋
Standard prototype lead time is 5-7 business days. Rush: 1-2 layer in 24 hours, 4-layer in 48 hours, 6+ layer in 72 hours. Actual lead time depends on thickness, surface finish, and layer count.
Q2. What is the minimum order quantity for PCB prototyping?＋
Minimum 1 board. We recommend 3-5 boards for prototyping — PCB manufacturing has batch effects so cost per unit is similar, and extra boards are useful for SMT trial assembly.
Q3. Which surface finish should I choose? HASL, ENIG, or OSP?＋
Lead-free HASL for general consumer electronics; ENIG for fine-pitch BGA/QFN or keypads; OSP for high-volume short-cycle products; ENEPIG for 5G or semiconductor packaging. Tell us your application and we will recommend.
Q4. Can you produce rigid-flex boards?＋
Yes. We support 2-12 layer rigid-flex boards. Minimum bend radius is adjusted per design. Ideal for wearables, medical devices, and automotive cameras where space is constrained. Provide a complete stackup and bend zone drawing for prototyping.
Q5. What information is needed for a quote?＋
Required: Gerber files (with NC Drill), layer count, board thickness, copper weight, surface finish, solder mask and silkscreen colors, quantity, lead time. For impedance-controlled boards include impedance specs; for flex include bend zone drawings.
Q6. What tests are run during mass production?＋
100% flying probe E-Test; impedance sampling on impedance boards; micro-section inspection (via copper, line width, layer registration); IPC-A-600 Class 2/3 visual inspection. Each batch ships with FAI report and COC.
Need a PCB / FPCB Manufacturing Quote?
Provide your Gerber files or design specifications, and we'll respond within one business day.
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